Areas of Research Interest

• Epoxy and polycyanate resins for electrical laminate applications
• High temperature resins for interlayer dielectric applications
• Thermally stable polymers for aerospace composite applications
• Thermoset polymer chemistry including toughening and flame retardancy

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Education

• PhD (Organic Chemistry), Colorado State University, Fort Collins, CO.  (1982); Thesis advisor:  Dr. J. K. Stille. Conducted research on palladium catalyzed coupling reactions utilizing organotin reagents
• BA (Chemistry), Lawrence University, Appleton, WI. (1978) Conducted research on natural products synthesis

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Research Experience

• Michigan Molecular Institute, Midland, MI, Research Scientist
• The Dow Chemical Company, Midland, MI. Senior Research Specialist; performed laboratory research in Core Research and Development Laboratories, 1982-2009

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U.S. Patents

1. Method of preparing an insoluble polymer film on a substrate from a soluble polymer containing labile solubilizing groups; 7,399,504
2. Multifunctional unsymmetrically substituted monomers and polyarylene compositions therefrom; 7,381,850
3. Porous composition of matter, and method of making same; 7,368,483
4. Composition containing a cross-linkable matrix precursor and a poragen, and porous matrix prepared therefrom; 7,109,249
5. Composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom; 6,887,910
   
6. Low dielectric constant polymers having good adhesion and toughness and articles made with such polymers; 6,790,792
7. Composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom; 6,653,358
8. Polyarylene compositions with enhanced modulus profiles; 6,646,081
9. Composition containing a cross-linkable matrix precursor and a poragen, and a porous matrix prepared therefrom; 6,630,520
10. Polyarylene compositions with enhanced modulus profiles; 6,359,091
11. Polyphenylene oligomers and polymers; 6,288,188
12. Ethynyl substituted aromatic compounds, synthesis, polymers and uses thereof; 6,252,001
13. Ethynyl substituted aromatic compounds, synthesis, polymers and uses thereof; 6,121,495
14. Polyphenylene oligomers and polymers; 5,965,679
15. Crosslinkable carbonate polymers of dihydroxyaryl fluorene; 5,516,877
16. Polymer resulting from the cure of a preformed chromene-containing mixture; 5,155,196
17. Process for preparing poly (vinylbenzyl ethers) of polyphenols; 4,956,442
18. Halogenated phenyl cyanates; 4,782,178
19. Copolymer of vinylbenzyl ether of polyhydric halogenated phenolic compound and aromatic polycyanate ester compound; 4,774,316

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Awards

• SiLK™ Semiconductor Dielectric was chosen as the Editor’s Choice Best Product 2000 by Semiconductor International
• The Dow Chemical Company was awarded the U. S. National Medal of Technology in 2002.  Dow received the award for developing new advanced materials, including SiLK™ Semiconductor Dielectric resin, which was invented, developed, and commercialized by Dow for the fabrication of high performance integrated circuits
  

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Publications

Papers

1. Recent advances in the synthesis of polyfluorenes as organic semiconductors - Brennan, David J.; Chen, Yu; Feng, Shaoguang; Godschalx, James P.; Spilman, Gary E.; Townsend, Paul H.; Kisting, Scott R.; Dibbs, Mitchell G.; Shaw, Jeff M.; Welsh, Dean M.; Miklovich, Jessica L.; Stutts, Debra.  The Dow Chemical Company, Midland, MI, USA.  Materials Research Society Symposium Proceedings (2004), 814 (Flexible Electronics 2004--Materials and Device Technology), 319-330.
2. Molecular brushes as templating agents for nanoporous SiLK* dielectric films - Niu, Q. Jason; Martin, Steven J.; Godschalx, James P.; Townsend, Paul H.  The Dow Chemical Company, Midland, MI, USA.  ACS Symposium Series (2004), 874 (Polymers for Microelectronics and Nanoelectronics), 199-208. 
3. Design of nanoporous polyarylene polymers for use as low-k dielectrics in microelectronic devices - Silvis, H. Craig; Bouck, Kevin J.; Godschalx, James P.; Niu, Q. Jason; Radler, Michael J.; Stokich, Ted M.; Lyons, John W.; Kern, Brandon J.; Marshall, Joan G.; Syverud, Karin; Leff, Mary.  Corporate Research and Development,  The Dow Chemical Company, Midland, MI, USA.  ACS Symposium Series (2004), 874 (Polymers for Microelectronics and Nanoelectronics), 187-198. 
4. Development of porous SiLK semiconductor dielectric resin for the 65 nm and 45 nm nodes - Strittmatter, R. J.; Hahnfeld, J. L.; Silvis, H. C.; Stokich, T. M.; Perry, J. D.; Ouellette, K. B.; Niu, Q. J.; Godschalx, J. P.; Kalantar, T. H.; Mubarekyan, E.; Hefner, R. E., Jr.; Lyons, J. W.; Dominowski, J. M.; Buske, G. R.  Advanced Electronic Materials, The Dow Chemical Company, Midland, MI, USA.  Materials Research Society Symposium Proceedings (2003), 766 (Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics--2003), 265-272.
5. Molecular bottle-brushes as templating agents for nanoporous SiLK* dielectric films - Niu, Q. Jason; Martin, Steven J.; Godschalx, James P.; Townsend, Paul H.  The Dow Chemical Company, Midland, MI, USA.  Abstracts of Papers, 224th ACS National Meeting, Boston, MA, United States, August 18-22, 2002 (2002), PMSE-118.
6. Development of a low-dielectric-constant polymer for the fabrication of integrated circuit interconnect - Martin, Steven J.; Godschalx, James P.; Mills, Michael E.; Shaffer, Edward O., II; Townsend, Paul H.  The Dow Chemical Company, Midland, MI, USA.  Advanced Materials (Weinheim, Germany) (2000), 12(23), 1769-1778.
7. Acetylene-chromene terminated resins as high-temperature thermosets - Godschalx, J. P.; Inbasekaran, M. N.; Bartos, B. R.; Scheck, D. M.; Laman, S. A.  Cent. Res., Dow Chem. Co., Midland, MI, USA.  International SAMPE Technical Conference (1990), 22 (Adv. Mater.), 163-74.
8. Synthesis of unsymmetrical diallyl ketones:  the palladium-catalyzed coupling of allyl halides with allyltin reagents in the presence of carbon monoxide - Merrifield, J. H.; Godschalx, J. P.; Stille, J. K.  Dep. Chem., Colorado State Univ., Fort Collins, CO, USA.  Organometallics (1984), 3(7), 1108-12.
9. Palladium-catalyzed cross coupling of allyl halides with organotin reagents:  a method of joining highly functionalized partners regioselectively and stereospecifically - Sheffy, Forrest K.; Godschalx, J. P.; Stille, J. K.  Dep. Chem., Colorado State Univ., Fort Collins, CO, USA.  Journal of the American Chemical Society (1984), 106(17), 4833-40.
10. Palladium and Lewis acid-catalyzed cross-coupling of allylic halides with organostannanes - Godschalx, James Peter.  Colorado State Univ., Fort Collins, CO, USA.  Avail. Univ. Microfilms Int., Order No. DA8317793. (1983), 219 pp.  Diss. Abstr. Int. B 1983, 44(4), 1118
11. Cross-coupling reaction of allyl bromides with organotin reagents catalyzed by zinc chloride - Godschalx, J. P.; Stille, J. K.  Dep. Chem., Colorado State Univ., Fort Collins, CO, USA.  Tetrahedron Letters (1983), 24(18), 1905-8.
12. Catalyzed cross-coupling of allyl bromides with allyl tin reagents - Godschalx, James; Stille, J. K.  Dep. Chem., Colorado State Univ., Fort Collins, CO, USA.  Tetrahedron Letters (1980), 21(27), 2599-602.

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Lectures and Presentations

1. The Effect of the Incorporation of Tougheners on the Drillability of Epoxy-based Electrical Laminates - Lameck Banda, James Godschalx, Bob Hearn, Michael Mullins (The Dow Chemical Company) IPC 2009.
2. Resin Options for Lead-Free Printed Circuit Boards - Michael J. Mullins, Robert L. Hearn, Lameck Banda, James Godschalx (The Dow Chemical Company)  IPC Dallas, December 2008.
3. Drill Hole Surface Roughness of a Toughened Epoxy-based Electrical Laminate - Lameck Banda, James Godschalx, Bernd Hoevel, Bob Hearn, Michael Mullins(The Dow Chemical Company)  IPC Midwest Conference and Exhibition, September 24, 2008.
4. Acetylene -chromene terminated resins as high-temperature thermosets - Godschalx, J. P.; Inbasekaran, M. N.; Bartos, B. R.; Scheck, D. M.; Laman, S. A.  International SAMPE Technical Conference (1990).

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